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Chemical wiring and soldering toward all-molecule electronic circuitry

Okawa, Yuji and Mandal, Swapan K. and Hu, Chunping and Tateyama, Yoshitaka and Goedecker, Stefan and Tsukamoto, Shigeru and Hasegawa, Tsuyoshi and Gimzewski, James K. and Aono, Masakazu. (2011) Chemical wiring and soldering toward all-molecule electronic circuitry. Journal of the American Chemical Society, 133 (21). pp. 8227-8233.

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Official URL: https://edoc.unibas.ch/76322/

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Abstract

Key to single-molecule electronics is connecting functional molecules to each other using conductive nanowires. This involves two issues: how to create conductive nanowires at designated positions, and how to ensure chemical bonding between the nanowires and functional molecules. Here, we present a novel method that solves both issues. Relevant functional molecules are placed on a self-assembled monolayer of diacetylene compound. A probe tip of a scanning tunneling microscope is then positioned on the molecular row of the diacetylene compound to which the functional molecule is adsorbed, and a conductive polydiacetylene nanowire is fabricated by initiating chain polymerization by stimulation with the tip. Since the front edge of chain polymerization necessarily has a reactive chemical species, the created polymer nanowire forms chemical bonding with an encountered molecular element. We name this spontaneous reaction "chemical soldering". First-principles theoretical calculations are used to investigate the structures and electronic properties of the connection. We demonstrate that two conductive polymer nanowires are connected to a single phthalocyanine molecule. A resonant tunneling diode formed by this method is discussed.
Faculties and Departments:05 Faculty of Science > Departement Physik > Physik > Physik (Goedecker)
UniBasel Contributors:Goedecker, Stefan
Item Type:Article, refereed
Article Subtype:Research Article
Publisher:American Chemical Society
ISSN:0002-7863
e-ISSN:1520-5126
Note:Publication type according to Uni Basel Research Database: Journal article
Identification Number:
Last Modified:21 Apr 2020 09:06
Deposited On:21 Apr 2020 09:06

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